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CLL5244B 754010 EP3C10 1N540 0KDDF 2900A1 SC1602F 2SC2001
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 TECHNICAL DATA
KK74HC00A Quad 2-Input NAND Gate
The KK74HC00A is identical in pinout to the LS/ALS00. The device inputs are compatible with standard CMOS outputs; with pullup resistors, they are compatible with LS/ALSTTL outputs. * Outputs Directly Interface to CMOS, NMOS, and TTL * Operating Voltage Range: 2.0 to 6.0 V * Low Input Current: 1.0 A * High Noise Immunity Characteristic of CMOS Devices ORDERING INFORMATION KK74HC00AN Plastic KK74HC00AD SOIC TA = -55 to 125 C for all packages
LOGIC DIAGRAM PIN ASSIGNMENT
FUNCTION TABLE
Inputs A L L H H PIN 14 =VCC PIN 7 = GND B L H L H Output Y H H H L
1
KK74HC00A
MAXIMUM RATINGS*
Symbol VCC VIN VOUT IIN IOUT ICC PD Tstg TL
*
Parameter DC Supply Voltage (Referenced to GND) DC Input Voltage (Referenced to GND) DC Output Voltage (Referenced to GND) DC Input Current, per Pin DC Output Current, per Pin DC Supply Current, VCC and GND Pins Power Dissipation in Still Air, Plastic DIP SOIC Package** Storage Temperature Lead Temperature, 1 mm from Case for 10 Seconds (Plastic DIP or SOIC Package)
**
Value -0.5 to +7.0 -1.5 to VCC +1.5 -0.5 to VCC +0.5 20 25 50 750 500 -65 to +150 260
Unit V V V mA mA mA mW C C
Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the Recommended Operating Conditions. ** Derating - Plastic DIP: - 10 mW/C from 65 to 125C SOIC Package: : - 7 mW/C from 65 to 125C
RECOMMENDED OPERATING CONDITIONS
Symbol VCC VIN, VOUT TA tr, tf Parameter DC Supply Voltage (Referenced to GND) DC Input Voltage, Output Voltage (Referenced to GND) Operating Temperature, All Package Types Input Rise and Fall Time (Figure 1) VCC =2.0 V VCC =4.5 V VCC =6.0 V Min 2.0 0 -55 0 0 0 Max 6.0 VCC +125 1000 500 400 Unit V V C ns
This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high-impedance circuit. For proper operation, VIN and VOUT should be constrained to the range GND(VIN or VOUT)VCC. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused outputs must be left open.
2
KK74HC00A
DC ELECTRICAL CHARACTERISTICS(Voltages Referenced to GND)
Symbol Parameter Test Conditions VCC V Guaranteed Limit 25 C to -55C 0.5 1.35 1.8 1.5 3.15 4.2 0.1 0.1 0.1 0.26 0.26 1.9 4.4 5.9 3.98 5.48 -0.1 0.1 1.0 85 C 0.5 1.35 1.8 1.5 3.15 4.2 0.1 0.1 0.1 0.33 0.33 1.9 4.4 5.9 3.84 5.34 -1.0 1.0 10 125 C 0.5 1.35 1.8 1.5 3.15 4.2 0.1 0.1 0.1 0.4 0.4 1.9 4.4 5.9 3.7 5.2 -1.0 1.0 40 A A A V V Unit
VIL
Maximum Low -Level Input Voltage Minimum High-Level Input Voltage Maximum Low-Level Output Voltage
VOUT=0.1 V or VCC=0.1 V IOUT 20 VOUT=0.1 V or VCC=0.1 V IOUT 20 VIN=VIH or VIL IOUT 20 A VIN=VIH or VIL IOUT 4.0 mA VIN=VIH or VIL IOUT 5.2 mA
2.0 4.5 6.0 2.0 4.5 6.0 2.0 4.5 6.0 4.5 6.0 2.0 4.5 6.0 4.5 6.0 6.0 6.0 6.0
VIH
V
VOL
V
VOH
Minimum High-Level Output Voltage
VIN=VIH or VIL IOUT 20 A VIN=VIH or VIL IOUT 4.0 mA VIN=VIH or VIL IOUT 5.2 mA
IIL IIH ICC
Maximum Low-Level Input Leakage Current Maximum High-Level Input Leakage Current Maximum Quiescent Supply Current (per Package)
VIL=GND VIH=VCC VIL=VCC VIH=GND IOUT=0 A
3
KK74HC00A
AC ELECTRICAL CHARACTERISTICS
Symbol Parameter Test Conditions VCC V Guaranteed Limit 25 C to -55C 75 15 13 75 15 13 10 85C 125C Unit
tPLH, tPHL
Maximum Propagation Delay, Input A or B to Output Y (Figures 1 and 2) Maximum Output Transition Time, Any Output (Figures 1 and 2) Maximum Input Capacitance Power Dissipation Capacitance (Per Gate) Used to determine the no-load dynamic power consumption: PD=CPDVCC2f+ICCVCC
VIL=0 V VIH=VCC tLH=tHL=6 ns CL = 50 pF VIL=0 V VIH=VCC tLH=tHL=6 ns CL = 50 pF
2.0 4.5 6.0 2.0 4.5 6.0 6.0 5.0
95 19 16 95 19 16 10
110 22 19 110 22 19 10
ns
tTLH, tTHL
ns
CIN CPD
pF pF
= 25C,VCC=5.0 V
Figure 1. Switching Waveforms
Figure 2. Test Circuit
4
KK74HC00A
N SUFFIX PLASTIC DIP (MS - 001AA)
A 14 8 B 1 7
Dimension, mm Symbol A B C MIN 18.67 6.1 MAX 19.69 7.11 5.33 0.36 1.14 2.54 7.62 0 2.92 7.62 0.2 0.38 10 3.81 8.26 0.36 0.56 1.78
F
L
D F
C -T- SEATING N G D 0.25 (0.010) M T K
PLANE
G H
H J
M
J K L M N
NOTES: 1. Dimensions "A", "B" do not include mold flash or protrusions. Maximum mold flash or protrusions 0.25 mm (0.010) per side.
D SUFFIX SOIC (MS - 012AB) Dimension, mm
8
A 14
Symbol A
MIN 8.55 3.8 1.35 0.33 0.4 1.27 5.27 0 0.1 0.19 5.8 0.25
MAX 8.75 4 1.75 0.51 1.27
H
B
P
B C
1
G
7 C R x 45
D F G
-TD 0.25 (0.010) M T C M K
SEATING PLANE
H
J F M
J K M P R
8 0.25 0.25 6.2 0.5
NOTES: 1. Dimensions A and B do not include mold flash or protrusion. 2. Maximum mold flash or protrusion 0.15 mm (0.006) per side for A; for B 0.25 mm (0.010) per side.
5


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